Tsunaaki SHIDEI


6 W/25 mm2 Wireless Power Transmission for Non-contact Wafer-Level Testing
Andrzej RADECKI Hayun CHUNG Yoichi YOSHIDA Noriyuki MIURA Tsunaaki SHIDEI Hiroki ISHIKURO Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/04/01
Vol. E95-C  No. 4  pp. 668-676
Type of Manuscript:  Special Section PAPER (Special Section on Solid-State Circuit Design – Architecture, Circuit, Device and Design Methodology)
Category: 
Keyword: 
inductive couplinginductive power transferwafer-level testing
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