Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2005/01/01
Vol. E88-C
No. 1
pp. 83-88
Type of Manuscript:
Special Section PAPER (Special Section on Recent Trends of Microwave and Millimeter-Wave Passive Circuit Components and Technologies for Improvement of Characteristics)
Category:
Keyword:
microwave, resin, PCB, balun, BPF, loss, integration, |
