Tohru KISHIMOTO


Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems
Tohru KISHIMOTO Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/10/25
Vol. E81-C  No. 10  pp. 1639-1647
Type of Manuscript:  PAPER
Category: Components
Keyword: 
ATM switching systemcard-on-board packagingplanar packaging systemforced air coolingthermal resistance
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Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems
Tohru KISHIMOTO Keiichi YASUNA Hiroki OKA Katsumi KAIZU Sinichi SASAKI Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1998/10/25
Vol. E81-B  No. 10  pp. 1894-1902
Type of Manuscript:  PAPER
Category: Communication Systems and Transmission Equipment
Keyword: 
planar packagingcard-on-board packagingmultichip modulecoaxial ZIF connectorATM switching system
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Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules
Tohru KISHIMOTO Shinichi SASAKI Katsumi KAIZU Kouichi GENDA Kenichi ENDO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/05/25
Vol. E78-C  No. 5  pp. 564-573
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
ATMmultichip moduleheat pipeforced air coolingthermal design
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High-Density, High-Pin-Count Flexible SMD Connector for High-Speed Data Bus
Shinichi SASAKI Tohru KISHIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1694-1701
Type of Manuscript:  PAPER
Category: Components
Keyword: 
componentsconnectorsurface mount device (SMD)FPC cableMCM
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High-Density, High-Bandwidth Connectors for Broad-Band ISDN
Ken-ichi NAKANO Kei-ichi YASUDA Tohru KISHIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1567-1574
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
Keyword: 
connectorcoaxialinterconnectionpackaging systemtelecommunication system
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Coaxial SMD Module Connector for High-Speed MCM
Shinichi SASAKI Tohru KISHIMOTO Nobuaki SUGIURA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1575-1580
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
Keyword: 
quasi-coaxialsurface mount technologySMDconnectormultichip module
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Two-Phase Thermosyphon Cooling for High-Power Multichip Modules
Tohru KISHIMOTO Akio HARADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/06/25
Vol. E77-C  No. 6  pp. 986-994
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
multichip modulethermosyphonheat pipethermal managementbroadband ISDN
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