Tohru KISHIMOTO

Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems
Tohru KISHIMOTO Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/10/25
Vol. E81-C  No. 10  pp. 1639-1647
Type of Manuscript:  PAPER
Category: Components
Keyword: 
ATM switching system, card-on-board packaging, planar packaging system, forced air cooling, thermal resistance, 
 Summary | Full Text:PDF
Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems
Tohru KISHIMOTO Keiichi YASUNA Hiroki OKA Katsumi KAIZU Sinichi SASAKI Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1998/10/25
Vol. E81-B  No. 10  pp. 1894-1902
Type of Manuscript:  PAPER
Category: Communication Systems and Transmission Equipment
Keyword: 
planar packaging, card-on-board packaging, multichip module, coaxial ZIF connector, ATM switching system, 
 Summary | Full Text:PDF
Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules
Tohru KISHIMOTO Shinichi SASAKI Katsumi KAIZU Kouichi GENDA Kenichi ENDO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/05/25
Vol. E78-C  No. 5  pp. 564-573
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
ATM, multichip module, heat pipe, forced air cooling, thermal design, 
 Summary | Full Text:PDF
High-Density, High-Pin-Count Flexible SMD Connector for High-Speed Data Bus
Shinichi SASAKI Tohru KISHIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1694-1701
Type of Manuscript:  PAPER
Category: Components
Keyword: 
components, connector, surface mount device (SMD), FPC cable, MCM, 
 Summary | Full Text:PDF
High-Density, High-Bandwidth Connectors for Broad-Band ISDN
Ken-ichi NAKANO Kei-ichi YASUDA Tohru KISHIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1567-1574
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
Keyword: 
connector, coaxial, interconnection, packaging system, telecommunication system, 
 Summary | Full Text:PDF
Coaxial SMD Module Connector for High-Speed MCM
Shinichi SASAKI Tohru KISHIMOTO Nobuaki SUGIURA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1575-1580
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
Keyword: 
quasi-coaxial, surface mount technology, SMD, connector, multichip module, 
 Summary | Full Text:PDF
Two-Phase Thermosyphon Cooling for High-Power Multichip Modules
Tohru KISHIMOTO Akio HARADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/06/25
Vol. E77-C  No. 6  pp. 986-994
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
multichip module, thermosyphon, heat pipe, thermal management, broadband ISDN, 
 Summary | Full Text:PDF