Tetsuaki WADA

Defect Detection of Passivation Layer by a Bias-Free Cu Decoration Method
Tetsuaki WADA Shinji NAKANO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/04/25
Vol. E77-C  No. 4  pp. 585-589
Type of Manuscript:  Special Section PAPER (Special Issue on LSI Failure Analysis)
semiconductorpassivationdefectreliabilityhumidity test
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Barrier Metal Effect on Electro- and Stress-Migration
Tetsuaki WADA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1994/01/25
Vol. E77-A  No. 1  pp. 180-186
Type of Manuscript:  Special Section PAPER (Special Section on Reliability)
Category: Failure Physics and Failure Analysis
semiconductormetalbarrier metalreliability electromigrationstress-migration
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