Teru NAKANISHI


A Novel Filter Construction Utilizing HTS Reaction-Type Filter to Improve Adjacent Channel Leakage Power Ratio of Mobile Communication Systems
Shunichi FUTATSUMORI Takashi HIKAGE Toshio NOJIMA Akihiko AKASEGAWA Teru NAKANISHI Kazunori YAMANAKA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/03/01
Vol. E92-C  No. 3  pp. 307-314
Type of Manuscript:  Special Section PAPER (Special Section on Recent Progress in Superconducting Analog Devices and Their Applications)
Category: Microwaves
Keyword: 
adjacent channel leakage power ratiohigh-temperature superconductorintermodulation distortionpower handling capabilityreaction-type filter
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Spurious Suppression Effect by Transmit Bandpass Filters with HTS Dual-Mode Resonators for 5 GHz Band
Kazunori YAMANAKA Kazuaki KURIHARA Akihiko AKASEGAWA Masatoshi ISHII Teru NAKANISHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/03/01
Vol. E92-C  No. 3  pp. 288-295
Type of Manuscript:  INVITED PAPER (Special Section on Recent Progress in Superconducting Analog Devices and Their Applications)
Category: 
Keyword: 
superconducting filterspurious suppressionYBCOpowertransmit
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RF Power Properties of YBCO-Film/LAO Microstrip Disk Resonators for 4 GHz Band
Kazunori YAMANAKA Akihiko AKASEGAWA Manabu KAI Teru NAKANISHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2006/02/01
Vol. E89-C  No. 2  pp. 156-162
Type of Manuscript:  Special Section PAPER (Special Section on Superconducting High-frequency Devices)
Category: 
Keyword: 
YBCOLAORFpowerdiskresonator
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Design and Fabrication of Superconducting Double Spiral Filter
Manabu KAI Teru NAKANISHI Akihiko AKASEGAWA Kazunori YAMANAKA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/12/01
Vol. E86-C  No. 12  pp. 2417-2421
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Trends on Microwave and Millimeter Wave Application Technology)
Category: Passive(Filter)
Keyword: 
spiralsuperconductorfilterQ factor
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Flip-Chip Interconnection Technology for Packaging of VLSI Operated in Liquid Nitrogen
Kaoru HASHIMOTO Masayuki OCHIAI Kazuaki KARASAWA Teru NAKANISHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2362-2368
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Interconnection
Keyword: 
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