| Teru NAKANISHI
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Flip-Chip Interconnection Technology for Packaging of VLSI Operated in Liquid Nitrogen Kaoru HASHIMOTO Masayuki OCHIAI Kazuaki KARASAWA Teru NAKANISHI | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C
No. 8
pp. 2362-2368
Type of Manuscript:
Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing) Category: Interconnection Keyword:
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