Tatsumi IDE


Contact Behaviors of New Material for Micro Relays
Terutaka TAMAI Tatsumi IDE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2004/08/01
Vol. E87-C  No. 8  pp. 1235-1240
Type of Manuscript:  Special Section PAPER (Special Section on IS-EMD2003--Recent Technical Trend of Electro-Mechanical Devices)
Category: New Technology and Automotive Applications
Keyword: 
contact resistanceadhesionstickingAg-Pd-Mg alloyAg-Pd alloycontact materialmicro relay
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