Takeshi YUASA

Ka-Band Branch Line Coupler Applied Hexagonal Waveguide Suitable for Additive Manufacturing
Motomi ABE Hidenori YUKAWA Yu USHIJIMA Takuma NISHIMURA Takeshi OSHIMA Takeshi YUASA Naofumi YONEDA 
Publication:   
Publication Date: 2018/10/01
Vol. E101-C  No. 10  pp. 805-814
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
3D printer, additive manufacturing, direct metal laser sintering, hexagonal waveguide, branch line coupler, 
 Summary | Full Text:PDF(2.8MB)
A PCB Integrated Multi-layered Strip Line Tandem Coupler Using Compensating Ground Through-Hole Elements
Takeshi YUASA Yukihiro TAHARA Tetsu OWADA Naofumi YONEDA Yoshihiko KONISHI Moriyasu MIYAZAKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2014/10/01
Vol. E97-C  No. 10  pp. 1014-1020
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
printed circuit board, multi-layered substrate, coupled line, ground through-hole, compensating element, 
 Summary | Full Text:PDF(899.4KB)
A Millimeter-Wave Resistance Error Tolerant Termination in Multi-Layered LTCC Substrate
Takeshi YUASA Yukihiro TAHARA Naofumi YONEDA Hideyuki OH-HASHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2011/03/01
Vol. E94-C  No. 3  pp. 321-326
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
multi-layered substrate, LTCC, termination, resistive film, manufacturing error, resistance error, 
 Summary | Full Text:PDF(1MB)
A Strip Line Broadside Hybrid Coupler Tolerant to Displacement Error and Thickness Variation in Multi-Layered LTCC Substrate
Takeshi YUASA Yukihiro TAHARA Hideyuki OH-HASHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/10/01
Vol. E91-C  No. 10  pp. 1684-1689
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
multi-layered substrate, LTCC, stripline, broadside coupler, hybrid coupler, manufacturing error, 
 Summary | Full Text:PDF(606.9KB)
Simple Design Formula for Parallel Plate Mode Suppression by Ground Via-Holes in Multi-Layered Packages
Takeshi YUASA Tamotsu NISHINO Hideyuki OH-HASHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/07/01
Vol. E88-C  No. 7  pp. 1401-1405
Type of Manuscript:  Special Section PAPER (Special Section on Recent Technologies of Microwave and Millimeter-Wave Devices Focusing on Miniaturization and Advancement in Performance with Their Applications)
Category: Passive Circuits
Keyword: 
multi-layered package, via-hole, coupling, mode-matching technique, 
 Summary | Full Text:PDF(621.7KB)