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Simple Design Formula for Parallel Plate Mode Suppression by Ground Via-Holes in Multi-Layered Packages Takeshi YUASA Tamotsu NISHINO Hideyuki OH-HASHI | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2005/07/01
Vol. E88-C
No. 7
pp. 1401-1405
Type of Manuscript:
Special Section PAPER (Special Section on Recent Technologies of Microwave and Millimeter-Wave Devices Focusing on Miniaturization and Advancement in Performance with Their Applications) Category: Passive Circuits Keyword: multi-layered package, via-hole, coupling, mode-matching technique, | | Summary | Full Text:PDF(621.7KB) | |
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