Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6pp. 810-818 Type of Manuscript: INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, bump, HIC (Hybrid IC), microwave, millimeter-wave,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6pp. 827-833 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, micro bump bonding, millimeter-wave, HFET, HBT,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6pp. 834-840 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: mobile communication, front-end, down-converter, GaAs, hybrid IC,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1995/08/25 Vol. E78-CNo. 8pp. 971-978 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology) Category: Keyword: millimeter-wave, flip-chip, IC (Integrated Circuit), microstrip line, bump,
