Takayuki YOSHIDA


High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs
Hiroyuki SAKAI Takayuki YOSHIDA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6  pp. 810-818
Type of Manuscript:  INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chipbumpHIC (Hybrid IC)microwavemillimeter-wave
 Summary | Full Text:PDF

Development of K-Band Front-End Devices for Broadband Wireless Communication Systems Using Millimeter-Wave Flip-Chip IC Technology
Kazuaki TAKAHASHI Suguru FUJITA Hiroyuki YABUKI Takayuki YOSHIDA Yoshito IKEDA Hiroyuki SAKAI Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6  pp. 827-833
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chipmicro bump bondingmillimeter-waveHFETHBT
 Summary | Full Text:PDF

Miniaturized Front-End HIC Using MBB Technology for Mobile Communication Equipment
Junji ITOH Tadayoshi NAKATSUKA Takayuki YOSHIDA Mitsuru NISHITSUJI Tomoya UDA Osamu ISHIKAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6  pp. 834-840
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
mobile communicationfront-enddown-converterGaAshybrid IC
 Summary | Full Text:PDF

A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
Hiroyuki SAKAI Yorito OTA Kaoru INOUE Takayuki YOSHIDA Kazuaki TAKAHASHI Suguru FUJITA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/08/25
Vol. E78-C  No. 8  pp. 971-978
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
Category: 
Keyword: 
millimeter-waveflip-chipIC (Integrated Circuit)microstrip linebump
 Summary | Full Text:PDF