Takao ABE


Contribution of Polished Surface Waviness to Final SOI Thickness Uniformity of Bonded Wafers through PACE Process
Kiyoshi MITANI Masatake NAKANO Takao ABE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/03/25
Vol. E80-C  No. 3  pp. 370-377
Type of Manuscript:  INVITED PAPER (Special Issue on SOI Devices and Their Process Technologies)
Category: Wafer Technologies
Keyword: 
surface wavinessPACESOI thickness uniformitypolishingPSD
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Thinned Silicon Layers on Oxide Film, Quartz and Sapphire by Wafer Bonding
Takao ABE Yasuyuki NAKAZATO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/03/25
Vol. E77-C  No. 3  pp. 342-349
Type of Manuscript:  INVITED PAPER (Special Issue on Quarter Micron Si Device and Process Technologies)
Category: 
Keyword: 
SOISi on quartzSOSwafer bondingdislocation-freesilicon layer
 Summary | Full Text:PDF