Takahiko SHINDO


High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices
Shigeru KANAZAWA Hiroshi YAMAZAKI Yuta UEDA Wataru KOBAYASHI Yoshihiro OGISO Johsuke OZAKI Takahiko SHINDO Satoshi TSUNASHIMA Hiromasa TANOBE Atsushi ARARATAKE 
Publication:   
Publication Date: 2019/04/01
Vol. E102-C  No. 4  pp. 340-346
Type of Manuscript:  INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
flip-chipEA-DFB laserMach-Zehnder modulatorpackaging
 Summary | Full Text:PDF(1.9MB)

Advantages of SOA Assisted Extended Reach EADFB Laser (AXEL) for Operation at Low Power and with Extended Transmission Reach
Wataru KOBAYASHI Naoki FUJIWARA Takahiko SHINDO Yoshitaka OHISO Shigeru KANAZAWA Hiroyuki ISHII Koichi HASEBE Hideaki MATSUZAKI Mikitaka ITOH 
Publication:   
Publication Date: 2017/10/01
Vol. E100-C  No. 10  pp. 759-766
Type of Manuscript:  INVITED PAPER (Joint Special Section on Opto-electronics and Communications for Future Optical Network)
Category: 
Keyword: 
electro-absorption modulatorsemiconductor optical amplifierDFB laser
 Summary | Full Text:PDF(1.8MB)