Taichi KON


1.8-Gb/s High-Speed Multichip Switching Module Using Copper-Polyimide Multilayer Substrate
Naoaki YAMANAKA Takaaki OHSAKI Shiro KIKUCHI Taichi KON Shinichi SASAKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2301-2308
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Multi Chip Module
Keyword: 
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