Tadatomo SUGA

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method
Eiji HIGURASHI Ken OKUMURA Yutaka KUNIMUNE Tadatomo SUGA Kei HAGIWARA 
Publication:   
Publication Date: 2017/02/01
Vol. E100-C  No. 2  pp. 156-160
Type of Manuscript:  INVITED PAPER (Special Section on Fabrication Technologies Supporting the Photonic/Nanostructure Devices)
Category: 
Keyword: 
heterogeneous integration, room-temperature bonding, surface-activated bonding, Au-Au bonding, 
 Summary | Full Text:PDF
Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration
Eiji HIGURASHI Michitaka YAMAMOTO Takeshi SATO Tadatomo SUGA Renshi SAWADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2016/03/01
Vol. E99-C  No. 3  pp. 339-345
Type of Manuscript:  INVITED PAPER (Special Section on Progress towards System Nanotechnology)
Category: 
Keyword: 
heterogeneous integration, low-temperature bonding, surface-activated bonding, atmospheric-pressure plasma, optical microsystems, 
 Summary | Full Text:PDF
Optical Microsensors Integration Technologies for Biomedical Applications
Eiji HIGURASHI Renshi SAWADA Tadatomo SUGA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/02/01
Vol. E92-C  No. 2  pp. 231-238
Type of Manuscript:  INVITED PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
Category: 
Keyword: 
microsensors, hybrid integration, passive alignment, low temperature bonding, laser Doppler flowmetry, 
 Summary | Full Text:PDF
Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals
Eiji HIGURASHI Daisuke CHINO Tadatomo SUGA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/02/01
Vol. E92-C  No. 2  pp. 247-251
Type of Manuscript:  Special Section PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
Category: 
Keyword: 
solder bumping, AuSn, plasma reflow, hydrogen radicals, solder particles, flux residues, 
 Summary | Full Text:PDF
Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air
Ryo TAKIGAWA Eiji HIGURASHI Tadatomo SUGA Satoshi SHINADA Tetsuya KAWANISHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/01/01
Vol. E90-C  No. 1  pp. 145-146
Type of Manuscript:  Special Section LETTER (Special Section on Microoptomechatronics)
Category: Micro/Nano Fabrication
Keyword: 
low-temperature bonding, Au-to-Au bonding, surface-activated bonding, lithium niobate/silicon structure, hybrid integration, 
 Summary | Full Text:PDF
Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
Tadatomo SUGA Yuzo ISHII Naoe HOSODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/02/25
Vol. E80-C  No. 2  pp. 297-302
Type of Manuscript:  Special Section PAPER (Special Issue on Micromachine Technology)
Category: Fabrication
Keyword: 
bonding, surface activated bonding, assembly, micro-system, integration, MEMS, micromachine, WWW, 
 Summary | Full Text:PDF
Piezoelectric Microcantilever Array for Multiprobe Scanning Force Microscopy
Toshihiro ITOH Ryutaro AZUMI Tadatomo SUGA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/02/25
Vol. E80-C  No. 2  pp. 269-273
Type of Manuscript:  Special Section PAPER (Special Issue on Micromachine Technology)
Category: Sensor
Keyword: 
multiprobe SFM, parallel operation, piezoelectric cantilever array, piezoelectric actuation, 
 Summary | Full Text:PDF
Scanning Force Microscope Using Piezoelectric Excitation and Detection
Toshihiro ITOH Takahiro OHASHI Tadatomo SUGA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/02/25
Vol. E78-C  No. 2  pp. 146-151
Type of Manuscript:  Special Section PAPER (Special Issue on Micromachines and Micro Electro Mechanical Systems)
Category: 
Keyword: 
SFM, piezoelectric microcantilever, ZnO, piezoelectric excitation, deflection detection, 
 Summary | Full Text:PDF