Susumu SHIBATA


Interconnection of Solder-Plated Copper Strips to Thin-Film Gold Wiring
Susumu SHIBATA Masaru KIMURA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1996/08/25
Vol. E79-C  No. 8  pp. 1177-1179
Type of Manuscript:  LETTER
Category: Components
Keyword: 
TABmetal-core substrateSEMEPMAAu-Sn alloy
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Examination of High-Speed, Low-Power-Consumption Thermal Head
Susumu SHIBATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/11/25
Vol. E78-C  No. 11  pp. 1632-1637
Type of Manuscript:  PAPER
Category: Recording and Memory Technologies
Keyword: 
high-speedlow-power-consumptionthermal headheat insulation layerheating resistorthermal conductivityheat characteristicglasspolyimide
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Development of Ultra Fine Wire and Fine Pitch Bonding Technology
Toshimitsu YAMASHITA Takashi KANAMORI Yasuo IGUCHI Yoshinori ARAO Susumu SHIBATA Yasuhide OHNO Yoshio OHZEKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2369-2377
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Manufacturing Technology
Keyword: 
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Effect of Film Thickness on Ta-Si-C High Resistivity Thin Films for Thermal Printing Heads
Tomohiro NAKAMORI Taiji TSURUOKA Takashi KANAMORI Susumu SHIBATA 
Publication:   IEICE TRANSACTIONS (1976-1990)
Publication Date: 1987/11/25
Vol. E70-E  No. 11  pp. 1133-1139
Type of Manuscript:  PAPER
Category: Materials
Keyword: 
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