Susumu KUROSAWA


An Analytical Modeling of Three Primary Wiring Capacitance Components for Multi-Layer Interconnect Structure
Susumu KUROSAWA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1995/12/25
Vol. E78-A  No. 12  pp. 1793-1798
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: 
Keyword: 
capacitancemodelinginterconnectLSILPE
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