Suguru FUJITA

Millimeter-Wave Wireless-LAN System Employing Compact and Cost-Effective 156 Mbps Transceiver MCMs
Kazuaki TAKAHASHI Suguru FUJITA Hiroyuki YABUKI Masugi INOUE Gang WU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/08/01
Vol. E86-C  No. 8  pp. 1512-1519
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter Wave Technology)
Category: 
Keyword: 
wireless LAN, millimeter-wave, multi chip module, DRO, MSK, 
 Summary | Full Text:PDF(1.6MB)
A Compact V-Band Filter/Antenna Integrated Receiver IC Built on Si-Micromachined BCB Suspended Structure
Kazuaki TAKAHASHI Ushio SANGAWA Suguru FUJITA Michiaki MATSUO Takeharu URABE Hiroshi OGURA Hiroyuki YABUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/10/01
Vol. E84-C  No. 10  pp. 1506-1514
Type of Manuscript:  Special Section PAPER (Special Issue on Millimeter-Wave Circuits and Fabrication Technologies Opening up the 21st Century)
Category: 
Keyword: 
micromachining, suspended line, benzocyclobutene, filter, antenna, 
 Summary | Full Text:PDF(1.8MB)
Development of K-Band Front-End Devices for Broadband Wireless Communication Systems Using Millimeter-Wave Flip-Chip IC Technology
Kazuaki TAKAHASHI Suguru FUJITA Hiroyuki YABUKI Takayuki YOSHIDA Yoshito IKEDA Hiroyuki SAKAI Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6  pp. 827-833
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
flip-chip, micro bump bonding, millimeter-wave, HFET, HBT, 
 Summary | Full Text:PDF(740.2KB)
A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
Hiroyuki SAKAI Yorito OTA Kaoru INOUE Takayuki YOSHIDA Kazuaki TAKAHASHI Suguru FUJITA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/08/25
Vol. E78-C  No. 8  pp. 971-978
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
Category: 
Keyword: 
millimeter-wave, flip-chip, IC (Integrated Circuit), microstrip line, bump, 
 Summary | Full Text:PDF(1MB)