Shinji NAKANO


Defect Detection of Passivation Layer by a Bias-Free Cu Decoration Method
Tetsuaki WADA Shinji NAKANO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/04/25
Vol. E77-C  No. 4  pp. 585-589
Type of Manuscript:  Special Section PAPER (Special Issue on LSI Failure Analysis)
Category: 
Keyword: 
semiconductorpassivationdefectreliabilityhumidity test
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