Shinichi SASAKI

Weight Compression MAC Accelerator for Effective Inference of Deep Learning
Asuka MAKI Daisuke MIYASHITA Shinichi SASAKI Kengo NAKATA Fumihiko TACHIBANA Tomoya SUZUKI Jun DEGUCHI Ryuichi FUJIMOTO 
Publication:   
Publication Date: 2020/10/01
Vol. E103-C  No. 10  pp. 514-523
Type of Manuscript:  Special Section PAPER (Special Section on Analog Circuits and Their Application Technologies)
Category: Integrated Electronics
Keyword: 
deep learning, convolutional neural network, quantization, variable bit width, post-training, inference, accelerator, processor, FPGA, 
 Summary | Full Text:PDF
Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules
Tohru KISHIMOTO Shinichi SASAKI Katsumi KAIZU Kouichi GENDA Kenichi ENDO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/05/25
Vol. E78-C  No. 5  pp. 564-573
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
ATM, multichip module, heat pipe, forced air cooling, thermal design, 
 Summary | Full Text:PDF
Coaxial SMD Module Connector for High-Speed MCM
Shinichi SASAKI Tohru KISHIMOTO Nobuaki SUGIURA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1575-1580
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
Keyword: 
quasi-coaxial, surface mount technology, SMD, connector, multichip module, 
 Summary | Full Text:PDF
High-Density, High-Pin-Count Flexible SMD Connector for High-Speed Data Bus
Shinichi SASAKI Tohru KISHIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10  pp. 1694-1701
Type of Manuscript:  PAPER
Category: Components
Keyword: 
components, connector, surface mount device (SMD), FPC cable, MCM, 
 Summary | Full Text:PDF
1.8-Gb/s High-Speed Multichip Switching Module Using Copper-Polyimide Multilayer Substrate
Naoaki YAMANAKA Takaaki OHSAKI Shiro KIKUCHI Taichi KON Shinichi SASAKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2301-2308
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Multi Chip Module
Keyword: 
 Summary | Full Text:PDF