Seimi SASAKI


Isolator-Free DFB-LD Module with TEC Control Using Silicon Waferboard
Koji TERADA Seimi SASAKI Kazuhiro TANAKA Tsuyoshi YAMAMOTO Tadashi IKEUCHI Kazunori MIURA Mitsuhiro YANO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/05/25
Vol. E80-C  No. 5  pp. 703-706
Type of Manuscript:  Special Section LETTER (Special Issue on Photonic Integrated Circuits)
Category: Optoelectronic Packaging
Keyword: 
WDMoptical access networkisolator-freelow power consumptionTECsilicon waferboard
 Summary | Full Text:PDF

High Optical Coupling Scheme in LD Modules with Silicon Platform Technology
Kazuhiro TANAKA Seimi SASAKI Gohji NAKAGAWA Tsuyoshi YAMAMOTO Kazunori MIURA Shouichi OGITA Mitsuhiro YANO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/01/25
Vol. E80-C  No. 1  pp. 107-111
Type of Manuscript:  Special Section PAPER (Special Issue on Devices, Packaging Technology, and Subsystems for the Optical Access Network)
Category: 
Keyword: 
silicon platformoptical couplingpassive alignmentmarkerlaser diodespot size transformer
 Summary | Full Text:PDF

Marker Alignment Method for Passive Laser Coupling on Silicon Waferboard
Seimi SASAKI Gohji NAKAGAWA Kazuhiro TANAKA Kazunori MIURA Mituhiro YANO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1996/07/25
Vol. E79-B  No. 7  pp. 939-942
Type of Manuscript:  Special Section LETTER (Special Issue on Optical Access Networks toward Life Enhancement)
Category: 
Keyword: 
silicon platformoptical couplingpassive alignmentmarkerlaser diode
 Summary | Full Text:PDF