Sadayuki OHNISHI


Accurate Modeling Method for Cu Interconnect
Kenta YAMADA Hiroshi KITAHARA Yoshihiko ASAI Hideo SAKAMOTO Norio OKADA Makoto YASUDA Noriaki ODA Michio SAKURAI Masayuki HIROI Toshiyuki TAKEWAKI Sadayuki OHNISHI Manabu IGUCHI Hiroyasu MINDA Mieko SUZUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/06/01
Vol. E91-C  No. 6  pp. 968-977
Type of Manuscript:  PAPER
Category: Semiconductor Materials and Devices
Keyword: 
Cuinterconnectcross-sectionmodeling
 Summary | Full Text:PDF

Chip-Level Performance Maximization Using ASIS (Application-Specific Interconnect Structure) Wiring Design Concept for 45 nm CMOS Generation
Noriaki ODA Hironori IMURA Naoyoshi KAWAHARA Masayoshi TAGAMI Hiroyuki KUNISHIMA Shuji SONE Sadayuki OHNISHI Kenta YAMADA Yumi KAKUHARA Makoto SEKINE Yoshihiro HAYASHI Kazuyoshi UENO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/04/01
Vol. E90-C  No. 4  pp. 848-855
Type of Manuscript:  Special Section PAPER (Special Section on Low-Power, High-Speed LSIs and Related Technologies)
Category: Device
Keyword: 
copperlow-kCMOSinterconnectdesignapplication
 Summary | Full Text:PDF