Renshi SAWADA

Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration
Eiji HIGURASHI Michitaka YAMAMOTO Takeshi SATO Tadatomo SUGA Renshi SAWADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2016/03/01
Vol. E99-C  No. 3  pp. 339-345
Type of Manuscript:  INVITED PAPER (Special Section on Progress towards System Nanotechnology)
Category: 
Keyword: 
heterogeneous integration, low-temperature bonding, surface-activated bonding, atmospheric-pressure plasma, optical microsystems, 
 Summary | Full Text:PDF
Optical Microsensors Integration Technologies for Biomedical Applications
Eiji HIGURASHI Renshi SAWADA Tadatomo SUGA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/02/01
Vol. E92-C  No. 2  pp. 231-238
Type of Manuscript:  INVITED PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
Category: 
Keyword: 
microsensors, hybrid integration, passive alignment, low temperature bonding, laser Doppler flowmetry, 
 Summary | Full Text:PDF