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A New Multilayer Ceramic-Frame Package for High-Frequency MMIC Modules Fuminori ISHITSUKA Nobuo SATO Haruhiko KATO | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C
No. 8
pp. 2344-2348
Type of Manuscript:
Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing) Category: Interconnection Keyword:
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A New Packaging Technology for GaAs MMIC Modules Hisashi TOMIMURO Fuminori ISHITSUKA Nobuo SATO Masahiro MURAGUCHI | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1991/05/25
Vol. E74-C
No. 5
pp. 1209-1213
Type of Manuscript:
Special Section PAPER (Special Issue on the 3rd Asia-Pacific Microwave Conference) Category: Active Devices and Circuits Keyword:
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A Theory for Sub-Linear Systems Nobuo SATO | Publication: IEICE TRANSACTIONS (1976-1990)
Publication Date: 1985/04/25
Vol. E68-E
No. 4
pp. 219-226
Type of Manuscript:
PAPER Category: General Keyword:
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