Mei-Fang CHIANG


Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density
Song CHEN Jianwei SHEN Wei GUO Mei-Fang CHIANG Takeshi YOSHIMURA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2010/12/01
Vol. E93-A  No. 12  pp. 2372-2379
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
redundant viadouble viadesign for manufacturabilityvia density
 Summary | Full Text:PDF(1.2MB)

Lagrangian Relaxation Based Inter-Layer Signal Via Assignment for 3-D ICs
Song CHEN Liangwei GE Mei-Fang CHIANG Takeshi YOSHIMURA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/04/01
Vol. E92-A  No. 4  pp. 1080-1087
Type of Manuscript:  Special Section PAPER (Special Section on Advanced Technologies Emerging Mainly from the 21st Workshop on Circuits and Systems in Karuizawa)
Category: 
Keyword: 
three dimensional integrated circuitsthrough-the-silicon viavia assignment
 Summary | Full Text:PDF(256.2KB)