Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2004/07/01
Vol. E87-C
No. 7
pp. 1197-1203
Type of Manuscript:
PAPER
Category: Microwaves, Millimeter-Waves
Keyword:
chip-size package (CSP), distributed amplifier, inverted microstrip line, grounded coplanar waveguide, flip-chip, InP HEMT, millimeter-wave, lead-free solder, |
