Masakazu SHIMAYA

The Influence of Stud Bumping above the MOSFETs on Device Reliability
Nobuhiro SHIMOYAMA Katsuyuki MACHIDA Masakazu SHIMAYA Hideo AKIYA Hakaru KYURAGI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2000/05/25
Vol. E83-A  No. 5  pp. 851-856
Type of Manuscript:  Special Section PAPER (Special Section on Reliability Theory and Its Applications)
Category: 
Keyword: 
stud bump, stress, interface traps, hot carrier, annealing, 
 Summary | Full Text:PDF(933.4KB)
An Analysis of and a Method of Enhancing the Intensity of OBIRCH Signal for Defects Observation in VLSI Metal Interconnections
Naoki KAWAMURA Tomoaki SAKAI Masakazu SHIMAYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/04/25
Vol. E77-C  No. 4  pp. 579-584
Type of Manuscript:  Special Section PAPER (Special Issue on LSI Failure Analysis)
Category: 
Keyword: 
OBIRCH, VLSI interconnection, failure analysis, defect observation, laser scanning microscope, OBIC, 
 Summary | Full Text:PDF(544.5KB)