IEICE Trans

Masahiro YANAGISAWA

1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1999/08/25 Vol. E82-B No. 8 pp. 1199-1208 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: optical transceiver module, PLC, hybrid integration, CMOS IC, ATM PON, full-duplex operation,
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1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/08/25 Vol. E82-C No. 8 pp. 1465-1474 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: optical transceiver module, PLC, hybrid integration, CMOS IC, ATM PON, full-duplex operation,
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Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs) Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/02/25 Vol. E82-C No. 2 pp. 370-378 Type of Manuscript: Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices) Category: Assembly and Packaging Technologies Keyword: PLC platform, hybrid integration, solder bump, flip-chip bonding, microstrip line,
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Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs) Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1999/02/25 Vol. E82-B No. 2 pp. 422-430 Type of Manuscript: Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices) Category: Assembly and Packaging Technologies Keyword: PLC platform, hybrid integration, solder bump, flip-chip bonding, microstrip line,
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Lubricant Design for Contact Recording Systems Masahiro YANAGISAWA Akinobu SATO Ken AJIKI
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/03/25 Vol. E81-C No. 3 pp. 343-348 Type of Manuscript: Special Section PAPER (Special Issue on Electromechanical Devices and their Surface Science) Category: Keyword: magnetic disk, high density recording, contact recording, tribology, lubricant,
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