Publication: IEICE TRANSACTIONS on Communications Publication Date: 1999/08/25 Vol. E82-BNo. 8pp. 1199-1208 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: optical transceiver module, PLC, hybrid integration, CMOS IC, ATM PON, full-duplex operation,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/08/25 Vol. E82-CNo. 8pp. 1465-1474 Type of Manuscript: Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications) Category: Optical Active Devices and Modules Keyword: optical transceiver module, PLC, hybrid integration, CMOS IC, ATM PON, full-duplex operation,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/02/25 Vol. E82-CNo. 2pp. 370-378 Type of Manuscript: Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices) Category: Assembly and Packaging Technologies Keyword: PLC platform, hybrid integration, solder bump, flip-chip bonding, microstrip line,
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1999/02/25 Vol. E82-BNo. 2pp. 422-430 Type of Manuscript: Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices) Category: Assembly and Packaging Technologies Keyword: PLC platform, hybrid integration, solder bump, flip-chip bonding, microstrip line,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/03/25 Vol. E81-CNo. 3pp. 343-348 Type of Manuscript: Special Section PAPER (Special Issue on Electromechanical Devices and their Surface Science) Category: Keyword: magnetic disk, high density recording, contact recording, tribology, lubricant,