Masahiro YANAGISAWA


1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies
Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/08/25
Vol. E82-B  No. 8  pp. 1199-1208
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Active Devices and Modules
Keyword: 
optical transceiver modulePLChybrid integrationCMOS ICATM PONfull-duplex operation
 Summary | Full Text:PDF

1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies
Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/08/25
Vol. E82-C  No. 8  pp. 1465-1474
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Active Devices and Modules
Keyword: 
optical transceiver modulePLChybrid integrationCMOS ICATM PONfull-duplex operation
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/02/25
Vol. E82-C  No. 2  pp. 370-378
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/02/25
Vol. E82-B  No. 2  pp. 422-430
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF

Lubricant Design for Contact Recording Systems
Masahiro YANAGISAWA Akinobu SATO Ken AJIKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/03/25
Vol. E81-C  No. 3  pp. 343-348
Type of Manuscript:  Special Section PAPER (Special Issue on Electromechanical Devices and their Surface Science)
Category: 
Keyword: 
magnetic diskhigh density recordingcontact recordingtribologylubricant
 Summary | Full Text:PDF