Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1997/05/25
Vol. E80-C
No. 5
pp. 703-706
Type of Manuscript:
Special Section LETTER (Special Issue on Photonic Integrated Circuits)
Category: Optoelectronic Packaging
Keyword:
WDM, optical access network, isolator-free, low power consumption, TEC, silicon waferboard, |
