Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2005/01/01 Vol. E88-CNo. 1pp. 83-88 Type of Manuscript: Special Section PAPER (Special Section on Recent Trends of Microwave and Millimeter-Wave Passive Circuit Components and Technologies for Improvement of Characteristics) Category: Keyword: microwave, resin, PCB, balun, BPF, loss, integration,