Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C
No. 11
pp. 2038-2043
Type of Manuscript:
Special Section PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword:
flip-chip bonding, millimeter wave, electromagnetic simulation, MMIC, low noise amplifier, coplanar waveguide, |
