Kei HAGIWARA


Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method
Eiji HIGURASHI Ken OKUMURA Yutaka KUNIMUNE Tadatomo SUGA Kei HAGIWARA 
Publication:   
Publication Date: 2017/02/01
Vol. E100-C  No. 2  pp. 156-160
Type of Manuscript:  INVITED PAPER (Special Section on Fabrication Technologies Supporting the Photonic/Nanostructure Devices)
Category: 
Keyword: 
heterogeneous integrationroom-temperature bondingsurface-activated bondingAu-Au bonding
 Summary | Full Text:PDF