Publication: Publication Date: 2017/10/01 Vol. E100-CNo. 10pp. 858-865 Type of Manuscript: Special Section PAPER (Special Section on Microwave and Millimeter-Wave Technology) Category: Keyword: Continuous Time, Discrete Time, low pass filter, equalizer, CMOS,
Publication: Publication Date: 2017/07/01 Vol. E100-BNo. 7pp. 1075-1085 Type of Manuscript: Special Section PAPER (Special Section on Smart Radio and Its Applications in Conjunction with Main Topics of SmartCom) Category: Terrestrial Wireless Communication/Broadcasting Technologies Keyword: IEEE 802.11ad, WiGig, 60 GHz, small cell, heterogeneous network, 5G cellular network,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2005/11/01 Vol. E88-ANo. 11pp. 3127-3133 Type of Manuscript: Special Section LETTER (Special Section on Wide Band Systems) Category: Keyword: MIMO, LC-diversity, LOS environments,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2003/08/01 Vol. E86-CNo. 8pp. 1512-1519 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter Wave Technology) Category: Keyword: wireless LAN, millimeter-wave, multi chip module, DRO, MSK,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2001/10/01 Vol. E84-CNo. 10pp. 1506-1514 Type of Manuscript: Special Section PAPER (Special Issue on Millimeter-Wave Circuits and Fabrication Technologies Opening up the 21st Century) Category: Keyword: micromachining, suspended line, benzocyclobutene, filter, antenna,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/11/25 Vol. E82-CNo. 11pp. 2029-2037 Type of Manuscript: INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century) Category: RF Assembly Technology Keyword: millimeter wave, flip-chip bonding, stud bump, micro bump, BCB, multi-layer,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6pp. 827-833 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, micro bump bonding, millimeter-wave, HFET, HBT,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1995/08/25 Vol. E78-CNo. 8pp. 971-978 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology) Category: Keyword: millimeter-wave, flip-chip, IC (Integrated Circuit), microstrip line, bump,