Katsumi KAIZU

Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems
Tohru KISHIMOTO Keiichi YASUNA Hiroki OKA Katsumi KAIZU Sinichi SASAKI Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1998/10/25
Vol. E81-B  No. 10  pp. 1894-1902
Type of Manuscript:  PAPER
Category: Communication Systems and Transmission Equipment
Keyword: 
planar packaging, card-on-board packaging, multichip module, coaxial ZIF connector, ATM switching system, 
 Summary | Full Text:PDF
Advanced ATM Switching System Hardware Technologies Based on MCM-D for ATM Line Interface Circuits
Tomoaki KAWAMURA Naoaki YAMANAKA Katsumi KAIZU 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1998/02/25
Vol. E81-B  No. 2  pp. 482-487
Type of Manuscript:  Special Section PAPER (Special Issue on ATM Switching Systems for future B-ISDN)
Category: Advanced technologies for ATM system
Keyword: 
ATM, MCM, assemble, sub-module, 
 Summary | Full Text:PDF
Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules
Tohru KISHIMOTO Shinichi SASAKI Katsumi KAIZU Kouichi GENDA Kenichi ENDO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/05/25
Vol. E78-C  No. 5  pp. 564-573
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
ATM, multichip module, heat pipe, forced air cooling, thermal design, 
 Summary | Full Text:PDF
Threshold-Voltage Instability of MOS Transistors in an LSI Memory under Accelerated Operating Test Condition at 77 K
Yoshio WATANABE Katsumi KAIZU Yukio FUKUDA 
Publication:   IEICE TRANSACTIONS (1976-1990)
Publication Date: 1983/06/25
Vol. E66-E  No. 6  pp. 397-398
Type of Manuscript:  LETTER
Category: Integrated Circuits
Keyword: 
 Summary | Full Text:PDF