Kaoru HASHIMOTO


Flip-Chip Interconnection Technology for Packaging of VLSI Operated in Liquid Nitrogen
Kaoru HASHIMOTO Masayuki OCHIAI Kazuaki KARASAWA Teru NAKANISHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2362-2368
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Interconnection
Keyword: 
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