Jurgen KASSNER


Innovative Packaging and Fabrication Concept for a 28 GHz Communication Front-End
Wolfgang MENZEL Jurgen KASSNER Uhland GOEBEL 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11  pp. 2021-2028
Type of Manuscript:  INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
packaginginterconnectfabrication techniquesplastic injection moldingwaveguide filters
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