Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C
No. 11
pp. 2021-2028
Type of Manuscript:
INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword:
packaging, interconnect, fabrication techniques, plastic injection molding, waveguide filters, |