Junji ICHIMIYA


On-Chip Thermal Gradient Analysis Considering Interdependence between Leakage Power and Temperature
Takashi SATO Junji ICHIMIYA Nobuto ONO Masanori HASHIMOTO 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2006/12/01
Vol. E89-A  No. 12  pp. 3491-3499
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Simulation and Verification
Keyword: 
thermal gradient simulationleakage powertemperature-dependent leakage powerpower calculationleakage model
 Summary | Full Text:PDF(1MB)

On-Chip Thermal Gradient Analysis and Temperature Flattening for SoC Design
Takashi SATO Junji ICHIMIYA Nobuto ONO Koutaro HACHIYA Masanori HASHIMOTO 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/12/01
Vol. E88-A  No. 12  pp. 3382-3389
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Prediction and Analysis
Keyword: 
thermal simulationthermal gradienttemperature flatteningclock skewreliabilitytiming
 Summary | Full Text:PDF(959.9KB)