Jun So PAK


Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network
Hyunjeong PARK Hyungsoo KIM Jun So PAK Changwook YOON Kyoungchoul KOO Joungho KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/04/01
Vol. E91-C  No. 4  pp. 595-606
Type of Manuscript:  PAPER
Category: Electromagnetic Theory
Keyword: 
co-modelinghierarchical power distribution network (PDN)chip and package
 Summary | Full Text:PDF

Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB
Jun So PAK Masahiro AOYAGI Katsuya KIKUCHI Joungho KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2006/04/01
Vol. E89-C  No. 4  pp. 551-559
Type of Manuscript:  PAPER
Category: Electronic Components
Keyword: 
power/ground planesignal viareturn currentsignal integritypower integrityradiated emission
 Summary | Full Text:PDF