Jason CONG

Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs
Kan WANG Sheqin DONG Yuchun MA Yu WANG Xianlong HONG Jason CONG 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2011/12/01
Vol. E94-A  No. 12  pp. 2490-2498
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
leakage powerTSVdelay-power-temperature dependence
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