Huaguo LIANG

A Region-Based Through-Silicon via Repair Method for Clustered Faults
Tianming NI Huaguo LIANG Mu NIE Xiumin XU Aibin YAN Zhengfeng HUANG 
Publication Date: 2017/12/01
Vol. E100-C  No. 12  pp. 1108-1117
Type of Manuscript:  PAPER
Category: Integrated Electronics
3D ICsyield enhancementTSV redundancyreparabilityadditional delay overhead
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Highly Robust Double Node Upset Resilient Hardened Latch Design
Huaguo LIANG Xin LI Zhengfeng HUANG Aibin YAN Xiumin XU 
Publication Date: 2017/05/01
Vol. E100-C  No. 5  pp. 496-503
Type of Manuscript:  PAPER
Category: Electronic Circuits
single event double node upsetsingle node upsetresilienceradiation hardened latch
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Reseeding-Oriented Test Power Reduction for Linear-Decompression-Based Test Compression Architectures
Tian CHEN Dandan SHEN Xin YI Huaguo LIANG Xiaoqing WEN Wei WANG 
Publication:   IEICE TRANSACTIONS on Information and Systems
Publication Date: 2016/11/01
Vol. E99-D  No. 11  pp. 2672-2681
Type of Manuscript:  PAPER
Category: Computer System
low power testdata compressionLFSRX-filling
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A Self-Recoverable, Frequency-Aware and Cost-Effective Robust Latch Design for Nanoscale CMOS Technology
Aibin YAN Huaguo LIANG Zhengfeng HUANG Cuiyun JIANG Maoxiang YI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/12/01
Vol. E98-C  No. 12  pp. 1171-1178
Type of Manuscript:  PAPER
Category: Electronic Circuits
transient faultsingle event upsetsoft errorradiation hardeningcircuit reliability
 Summary | Full Text:PDF(1.7MB)