Assigning Polarity to Causal Information in Financial Articles on Business Performance of Companies Hiroyuki SAKAIShigeru MASUYAMA
Publication: IEICE TRANSACTIONS on Information and Systems Publication Date: 2009/12/01 Vol. E92-DNo. 12pp. 2341-2350 Type of Manuscript: Special Section PAPER (Special Section on Natural Language Processing and its Applications) Category: Document Analysis Keyword: polarity assignment, text mining, causal information, knowledge extraction, information extraction,
Publication: IEICE TRANSACTIONS on Information and Systems Publication Date: 2008/04/01 Vol. E91-DNo. 4pp. 986-989 Type of Manuscript: Special Section LETTER (Special Section on Knowledge-Based Software Engineering) Category: Keyword: informative region identification, Web document, DOM, layout analysis,
Publication: IEICE TRANSACTIONS on Information and Systems Publication Date: 2008/04/01 Vol. E91-DNo. 4pp. 959-968 Type of Manuscript: Special Section PAPER (Special Section on Knowledge-Based Software Engineering) Category: Knowledge Engineering Keyword: cause information, causal expression, knowledge extraction, information extraction,
A Statistical Method for Acquiring Knowledge about the Abbreviation Possibility of Some of Multiple Adnominal Phrases Hiroyuki SAKAIShigeru MASUYAMA
Publication: IEICE TRANSACTIONS on Information and Systems Publication Date: 2003/09/01 Vol. E86-DNo. 9pp. 1710-1718 Type of Manuscript: Special Section PAPER (Special Issue on Text Processing for Information Access) Category: Keyword: abbreviation of multiple adnominal phrases, corpus, summarization, mutual information,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6pp. 827-833 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, micro bump bonding, millimeter-wave, HFET, HBT,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6pp. 810-818 Type of Manuscript: INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, bump, HIC (Hybrid IC), microwave, millimeter-wave,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1995/08/25 Vol. E78-CNo. 8pp. 971-978 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology) Category: Keyword: millimeter-wave, flip-chip, IC (Integrated Circuit), microstrip line, bump,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1991/04/25 Vol. E74-CNo. 4pp. 818-826 Type of Manuscript: Special Section PAPER (Special Issue on LSI Memories) Category: DRAM Keyword: