Hirokazu YONEZAWA


A Modeling Methodology and Body Effect Analysis for Hot-Carrier Reliability Simulation of Logic Circuits
Norio KOIKE Hirokazu YONEZAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2002/06/01
Vol. E85-C  No. 6  pp. 1356-1366
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
hot carriersecondary hot electronsimulation
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