IEICE Trans

Hideo AKIYA

The Influence of Stud Bumping above the MOSFETs on Device Reliability Nobuhiro SHIMOYAMA Katsuyuki MACHIDA Masakazu SHIMAYA Hideo AKIYA Hakaru KYURAGI
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2000/05/25 Vol. E83-A No. 5 pp. 851-856 Type of Manuscript: Special Section PAPER (Special Section on Reliability Theory and Its Applications) Category: Keyword: stud bump, stress, interface traps, hot carrier, annealing,
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Propagation Results of the Magnetic Bubble in Dual Conductor Current Access Test Circuits Hideo AKIYAMA Toshiwo KAWASAKI Taiji TSURUOKA Kazutami KAWAMURA Takaaki MIYASHITA
Publication: IEICE TRANSACTIONS (1976-1990) Publication Date: 1981/10/25 Vol. E64-E No. 10 pp. 671-672 Type of Manuscript: LETTER Category: Other Devices Keyword:
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