Hideki TSUNETSUGU


Ultra-High-Speed GaAs MESFET IC Modules Using Flip Chip Bonding
Hiroyuki KIKUCHI Hideki TSUNETSUGU Makoto HIRANO Satoshi YAMAGUCHI Yuhki IMAI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/03/25
Vol. E82-C  No. 3  pp. 475-482
Type of Manuscript:  Special Section PAPER (Special Issue on Ultra-High-Speed IC and LSI Technology)
Category: Compound Semiconductor Devices
Keyword: 
GaAs MESFETamplifierdistributormicrostrip lineflip chip
 Summary | Full Text:PDF(573.9KB)

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/02/25
Vol. E82-C  No. 2  pp. 370-378
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF(869.9KB)

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/02/25
Vol. E82-B  No. 2  pp. 422-430
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF(869.6KB)