Hideki KUSAMITSU


1 Gb/s, 50 µm 50 µm Pads on Board Wireless Connector Based on Track-and-Charge Scheme Allowing Contacted Signaling
Katsuyuki IKEUCHI Hideki KUSAMITSU Mutsuo DAITO Gil-Su KIM Makoto TAKAMIYA Takayasu SAKURAI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2011/06/01
Vol. E94-C  No. 6  pp. 992-998
Type of Manuscript:  Special Section PAPER (Special Section on Analog Circuits and Related SoC Integration Technologies)
Category: 
Keyword: 
capacitive couplingproximity communicationwireless connectors
 Summary | Full Text:PDF

Millimeter-Wave Flip-Chip MMIC Structure with High Performance and High Reliability Interconnects
Masaharu ITO Kenichi MARUHASHI Hideki KUSAMITSU Yoshiaki MORISHITA Keiichi OHATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11  pp. 2038-2043
Type of Manuscript:  Special Section PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
flip-chip bondingmillimeter waveelectromagnetic simulationMMIClow noise amplifiercoplanar waveguide
 Summary | Full Text:PDF