Hidehiko KIRA


100-GHz Ultra-Broadband Distributed Amplifier in Chip-Size Package
Satoshi MASUDA Kazuhiko KOBAYASHI Hidehiko KIRA Masayuki KITAJIMA Kazukiyo JOSHIN 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2004/07/01
Vol. E87-C  No. 7  pp. 1197-1203
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
chip-size package (CSP)distributed amplifierinverted microstrip linegrounded coplanar waveguideflip-chipInP HEMTmillimeter-wavelead-free solder
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