Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2006/03/01 Vol. E89-CNo. 3pp. 320-326 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design Technology in the Sub-100 nm Era) Category: Interface and Interconnect Techniques Keyword: inductive coupling, wireless superconnect, 3D-stacked chips, low power, high bandwidth,
