Cong HAO


An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment
Cong HAO Takeshi YOSHIMURA 
Publication:   
Publication Date: 2017/03/01
Vol. E100-A  No. 3  pp. 776-784
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
3D-ICTSV assignmentmulti commodity flow
 Summary | Full Text:PDF(1.6MB)

Leakage Power Aware Scheduling in High-Level Synthesis
Nan WANG Song CHEN Cong HAO Haoran ZHANG Takeshi YOSHIMURA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2014/04/01
Vol. E97-A  No. 4  pp. 940-951
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
dual-Vthleakage powermax-flow min-cut
 Summary | Full Text:PDF(2MB)